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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Effects of Temperature, Moisture and Mechanical Driving Forces

Y.-W. Mai, E-H Wong

Woodhead Publishing
Publication date : 2015-05-23

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study

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About the book

Author

Y.-W. Mai , E-H Wong

Imprint

Woodhead Publishing

Collection

n.c

Publication date

2015-05-23

Pages

482 pages

Print ISBN

9781845695286

Language

English

Ebook informations

EAN PDF

9780857099112

Price

£126.60

Copy count 48

Print count 48

File size 25876 Ko

Informations accessibility

EAN EPUB DRM-FREE

9780857099112

Price

£126.60

Informations accessibility

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About author(s)

Y.-W. Mai

E-H Wong

Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia

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