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Handbook of 3D Integration, Volume 1

Handbook of 3D Integration, Volume 1

Technology and Applications of 3D Integrated Circuits

Christopher Bower, Philip Garrou, Peter Ramm

Wiley-VCH
Publication date : 2011-09-22

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects.
It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

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About the book

Author

Christopher Bower , Philip Garrou , Peter Ramm

Imprint

Wiley-VCH

Collection

n.c

Publication date

2011-09-22

Pages

798 pages

Print ISBN

9783527320349

Language

English

Ebook informations

EAN PDF

9783527623068

Price

£220.44

Copy count 0

Print count 798

File size 94720 Ko

Informations accessibility

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About author(s)

Christopher Bower

Philip Garrou

Peter Ramm

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