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The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on...
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver,...
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PDF : format reprenant la maquette originale du livre ; lecture recommandée sur ordinateur et tablette EPUB : format de texte repositionnable ; lecture sur tous supports (ordinateur, tablette, smartphone, liseuse)
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