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With the development of social and science, new requirements are put forward for geotechnical engineering. Advanced geotechnical techniques were proposed to solve the new challenges in geotechnical engineering. The articles presented in this volume aim to the new...
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on...
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power...
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