Home Home >
Reference >
Science >
Electromigration Modeling at Circuit Layout Level

Click for an excerpt

Electromigration Modeling at Circuit Layout Level

Feifei He, Cher Ming Tan

Springer
Collection: SpringerBriefs in Applied Sciences and Technology
Publication date : 2013-03-16

Voir les informations d'accessibilité

Add to basket

£44,99

Download | LCP DRM 🛈 Adobe DRM 🛈

Streaming

Add to my wish list

Louise Reader

Read on Louise Reader App.

Get £6.75 by recommending this book

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

Les livres numériques peuvent être téléchargés depuis l'ebookstore Numilog ou directement depuis une tablette ou smartphone.

PDF : format reprenant la maquette originale du livre ; lecture recommandée sur ordinateur et tablette
EPUB : format de texte repositionnable ; lecture sur tous supports (ordinateur, tablette, smartphone, liseuse)

Votre support de lecture	Format	Protection	Application
Ordinateur	-EPUB -PDF	DRM Adobe LCP	Lecture en ligne (streaming) Adobe Digital Editions(DRM Adobe) Thorium Reader (LCP)
Tablette et smartphone iOS / Android	EPUB PDF	LCP DRM Adobe	Application Louise Reader : IOS / Android(ne lit pas les fichiers protégés par Adobe DRM) Adobe Digital Edition : IOS/Android(Lit uniquement la DRM Adobe)
Liseuse	EPUB	DRM Adobe	Module de lecture de la liseuse
Liseuse Diva	EPUB	LCP DRM Adobe	Module de lecture de la liseuse Diva

Consultez l’aide pour en savoir plus.

About the book

Author

Feifei He , Cher Ming Tan

Imprint

Springer

Collection

SpringerBriefs in Applied Sciences and Technology

Publication date

2013-03-16

Pages

103 pages

Print ISBN

9789814451208

Language

English

Ebook informations

EAN EPUB

9789814451215

Price

£44.99

Copy count 1

Print count 10

File size 3963 Ko

Informations accessibility

Compatibility

To check the compatibility with your devices,
see help page

About author(s)

Feifei He

Cher Ming Tan

You may also be interested in...