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Arbitrary Modeling of TSVs for 3D Integrated Circuits

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Arbitrary Modeling of TSVs for 3D Integrated Circuits

Alaa El-Rouby, Yehea Ismail, Khaled Salah

Springer
Collection: Analog Circuits and Signal Processing
Publication date : 2014-08-21

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

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About the book

Author

Alaa El-Rouby , Yehea Ismail , Khaled Salah

Imprint

Springer

Collection

Analog Circuits and Signal Processing

Publication date

2014-08-21

Pages

179 pages

Print ISBN

9783319076102

Language

English

Ebook informations

EAN EPUB

9783319076119

Price

£89.50

Copy count 1

Print count 17

File size 3881 Ko

Informations accessibility

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About author(s)

Alaa El-Rouby

Yehea Ismail

Khaled Salah

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