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Chiplet Design and Heterogeneous Integration Packaging

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Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

Springer
Publication date : 2023-03-27

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The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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About the book

Author

John H. Lau

Imprint

Springer

Collection

n.c

Publication date

2023-03-27

Pages

525 pages

Print ISBN

9789811999161

Language

English

Ebook informations

EAN PDF

9789811999178

Price

£109.50

Copy count 5

Print count 52

File size 31130 Ko

Informations accessibility

EAN EPUB

9789811999178

Price

£109.50

Copy count 5

Print count 52

File size 324096 Ko

Informations accessibility

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About author(s)

John H. Lau

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