All ebooks by John H. Lau in PDF and EPUB
Readzis program recommandation

All ebooks by John H. Lau in PDF and EPUB


6  Book(s)
Download this eBook Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Add to my wish list

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology


John H. Lau


This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice.This is achieved...

Publication date: 2024-05-23
Format: PDF, ePub
Publisher: Springer
Add to basket
£149,99
Download this eBook Chiplet Design and Heterogeneous Integration Packaging
Add to my wish list

Chiplet Design and Heterogeneous Integration Packaging


John H. Lau


The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by...

Publication date: 2023-03-27
Format: PDF, ePub
Publisher: Springer
Add to basket
£109,50
Download this eBook Semiconductor Advanced Packaging
Add to my wish list

Semiconductor Advanced Packaging


John H. Lau


The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...

Publication date: 2021-05-17
Format: PDF, ePub
Publisher: Springer
Add to basket
£99,50
Download this eBook Assembly and Reliability of Lead-Free Solder Joints
Add to my wish list

Assembly and Reliability of Lead-Free Solder Joints


John H. Lau , Ning-Cheng Lee , Ning-Cheng Lee


This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter.This is achieved by providing in-depth studies on a number of major topics such as solder...

Publication date: 2020-05-29
Format: PDF, ePub
Publisher: Springer
Add to basket
£99,50
Download this eBook Heterogeneous Integrations
Add to my wish list

Heterogeneous Integrations


John H. Lau


Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components...

Publication date: 2019-04-03
Format: PDF, ePub
Publisher: Springer
Add to basket
£139,50
Download this eBook Fan-Out Wafer-Level Packaging
Add to my wish list

Fan-Out Wafer-Level Packaging


John H. Lau


This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for...

Publication date: 2018-04-05
Format: PDF, ePub
Publisher: Springer
Add to basket
£99,50

Sign up to get our latest ebook recommendations and special offers


Paiements sécurisés