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Electromigration in Metals

Electromigration in Metals

Fundamentals to Nano-Interconnects

Martin Gall, Paul S. Ho, Chao-Kun Hu, Valeriy Sukharev

Cambridge University Press
Publication date : 2022-05-12

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Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

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About the book

Author

Martin Gall , Paul S. Ho , Chao-Kun Hu , Valeriy Sukharev

Imprint

Cambridge University Press

Collection

n.c

Publication date

2022-05-12

Pages

n.c

Print ISBN

9781107032385

Language

English

Ebook informations

EAN PDF

9781009287791

Price

£82.29

Copy count 0

Print count 0

File size 22211 Ko

Informations accessibility

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About author(s)

Martin Gall

Paul S. Ho

Chao-Kun Hu

Valeriy Sukharev

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