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Download this eBook Interconnect Reliability in Advanced Memory Device Packaging
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Interconnect Reliability in Advanced Memory Device Packaging


Chong Leong, Gan , Chen-Yu, Huang


This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.This book discusses the reliability and technical challenges...

Publication date: 2023-04-28
Format: PDF, ePub
Publisher: Springer
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£179,99

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