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Download this eBook Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture


E-H Wong , Y.-W. Mai


Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of...

Publication date: 2015-05-23
Format: PDF, epub DRM-free
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£126,60

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